Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

2003.11a
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Pages.12-12
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2003

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)

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Effect of EMC Characteristics on Package Warpage Behavior

EMC 특성이 Package warpage 거동에 미치는 영향

SONG Jae-kyu (Material & Process Development Team, R&D center, Amkor Technology Korea, Inc.) ;
YOO Min (Material & Process Development Team, R&D center, Amkor Technology Korea, Inc.) ;
YOO HeeYeoul (Material & Process Development Team, R&D center, Amkor Technology Korea, Inc.)

Published : 2003.11.01

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Abstract

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