한국윤활학회:학술대회논문집 (Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference)
- 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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- Pages.139-140
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- 2002
The Mechanical Property of Electroplated Cu Film
- Cho, Chul-Ho (Graduate School of Precision Mechanical Engineering, Hanyang University) ;
- Ha, Seung-Mo (Graduate School of Precision Mechanical Engineering, Hanyang University) ;
-
Ahn, Yoo-Min
(Department of Mechanical Engineering, Hanyang University)
;
- Kim, Dae-Kun (Graduate School of Advanced Materials Engineering, Hongik University) ;
- Lee, Jae-Ho (Department of Advanced Materials Engineering, Hongik University)
- 발행 : 2002.10.21
초록
This paper discusses the effect of plating condition on the mechanical property of electroplated Cu film. Current density, the amount of the organic additives was found to affect the residual stress of electroplated copper film. The result show that, in the case of residual stress, the copper film deposited at higher additive result in lower residual stress and plating current by