CMP 평탄화 기술 동향과 전망

CMP Planarization Technology Trends and Vision

To achieve the global planarization, CMP Technology has been used to the next generation semiconductor process, and the study made tremendous progress up to date. As the device demension shrinked， CMP Technology has been applied in a various way and more people interested in this field to simplify the process. To attain the goal for safer 0.13um or below 10 nano process, many of those expected task must be solved. By describing this current CMP process issue and future trend for the CMP planarization process, It personally hope that this paper would help to the people who has concerns for the next generation semiconductor manufacturing industry in common.