한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)

한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
권호 표지

Screen-printing법으로 제작한 BSCT 후막의 구조적 특성

The Structural properties of BSCT thick films fabricated by screen-printing method

  • 허영식 (서남대학교 전자전기공학부) ;
  • 이성갑 (서남대학교 전자전기공학부) ;
  • 박상만 (서남대학교 전자전기공학부) ;
  • 이영희 (광운대학교 반도체 및 신소재공학과)
  • 발행 : 2002.07.08
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초록

$(Ba_{0.6-x}Sr_{0.4}Ca_x)TiO_3$(BSCT) (x=0.10, 0.15, 0.20) powders were prepared by the sol-gel method and BSCT thick films were fabricated by the screen-printing method. The structural properties as a faction of the composition ratio were studied. As a result of the differential thermal analysis (DTA), exothermic perk was observed at around $860^{\circ}C$ dne to the formation of the polycrystalline perovskite phase. The BSCT thick films sintered at $1350^{\circ}C$ for 2h showed the average grain size of $2{\sim}7{\mu}m$. The average thickness of BSCT thick films, obtained by 3 times of screen-printing, was approximately $85{\mu}m$.

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과제정보

연구 과제 주관 기관 : 한국과학재단