증발을 고려한 Wafer Spin Coating 박막 예측에 관한 수치 해석적 연구

The fluid flow, mass transfer, heat transfer and film thickness variation during the spin coating process are numerically studied. The model is said to be 1-dimensional because radial variations in film thickness, concentration and temperature are ignored. The finite difference method is employed to solve the equations that are simplified using the similarity transformation. In early time film thinning is due to the radial convective outflow. However that slows during the first seconds of spinning so the film thinning due to evaporation of solvent becomes sole. The time various film thickness is analyzed according to the var ious solvent fraction in the coating liquid and in the bulk of the overlying gas and the temperature variation in the liquid film during the spin coating is estimated.