Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2002.09a
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- Pages.219-225
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- 2002
BUMPLESS FLIP CHIP PACKAGE FOR COST/PERFORMANCE DRIVEN DEVICES
- Lin, Charles W.C. (Bridge Semiconductor Corporation) ;
- Chiang, Sam C.L. (Bridge Semiconductor Corporation) ;
- Yang, T.K.Andrew (Bridge Semiconductor Corporation)
- Published : 2002.09.01
Abstract
This paper presents a novel "bumpless flip chip package"for cost! performance driven devices. Using the conventional electroplating and etching processes, this package enables the production of fine pitch BGA up to 256 I/O with single layer routing. An array of circuitry down to
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