Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Anisotropic Conductive Adhesives(ACAs) Flip Chip Technology: Low Cost and Reliable Flip Chip Alternative

  • Paik, Kyung W. (KAIST Dept. of Materials Science and Engineering)
  • Published : 2002.09.01
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