Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2002.09a
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- Pages.53-68
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- 2002
New Flip Chip Attach Technology by Bumps Formed on Substrate
- Fukuoka, Yoshitaka (Worldwide Electronic Integrated Substrate Technology Inc. (Weisti))
- Published : 2002.09.01
Abstract
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