제어로봇시스템학회:학술대회논문집
- 제어로봇시스템학회 2002년도 ICCAS
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- Pages.87.5-87
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- 2002
Image Analysis for Detection of Defects of BGA by Using X-ray Imaging
- Sumimoto, Tetsuhiro (Okayama Univ.) ;
- Maruyama, Toshinori (Okayama Univ.) ;
- Azuma, Yoshiru (Okayama Univ.) ;
- Goto, Sachiko (Okayama Univ.) ;
- Mondou, Munehiro (Pref. Hiroshima) ;
- furukwa, Noboru (Pref. Hiroshima) ;
- Okada, Saburo (AIST)
- 발행 : 2002.10.01
초록
. A high peak power demand at substations will result under This paper deals with the detection of defects at BGA solder joints in PC boards by using X-ray Imaging. . To improve a cost performance and reliability of PC boards, an inspection of BGA is required in the surface mount process. . Contents 2 We attempt to detect the characteristic of the solder bridges based on an image analysis.
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