대한용접접합학회:학술대회논문집 (Proceedings of the KWS Conference)

대한용접접합학회 (The Korean Welding and Joining Society)
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INTERFACIAL REACTIONS BETWEEN SN-58MASS%BI EUTECTIC SOLDER AND (CU, ELECTROLESS NI-P/CU)SUBSTRATE

  • Yoon, Jeong-Won (Department of Advanced Materials Engineering, SungKyunKwan University) ;
  • Lee, hang-Bae (Graduate School of Engineering, Osaka University) ;
  • Park, Guang-Jin (School of Advanced Materials & Process Engineering, InJe University) ;
  • Shin, Young-Eui (Department of Mechanical Engineering, Chungang University) ;
  • Jung, Seung-Boo (Department of Advanced Materials Engineering, SungKyunKwan University)
  • 발행 : 2002.10.01
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초록

The growth kinetics of intermetallic compound layers formed between eutectic Sn-58Bi solder and (Cu, electroless Ni-P/Cu) substrate were investigated at temperature between 70 and 120 C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P system satisfied the parabolic law at given temperature range. As a whole, because the values of time exponent (n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energies of Cu$_{6}$Sn$_{5}$ and Ni$_3$Sn$_4$ intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P were 127.9 and 81.6 kJ/mol, respectively.ely.

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