Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference (한국초전도저온공학회:학술대회논문집)

The Korean Society of Superconductivity and Cryogenics (한국초전도저온학회)
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Measurement of joint resistance of Bi-2223/Ag tapes using field decay technique

자장감쇄법을 이용한 Bi-2223/Ag 선재의 접합저항 측정 평가

  • 김정호 (성균관대학교 금속재료공학부) ;
  • 김규태 (성균관대학교 금속재료공학부) ;
  • 주진호 (성균관대학교 금속재료공학부) ;
  • 최세용 (성균관대학교 전기전자컴퓨터공학부) ;
  • 나완수 (성균관대학교 전기전자컴퓨터공학부) ;
  • 하홍수 (한국전기연구원 초전도응용연구그룹) ;
  • 오상수 (한국전기연구원 초전도응용연구그룹)
  • Published : 2002.02.01
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Abstract

Considering the application of high temperature superconductor to MRI, the loss at conductor joint would be very important. Therefore, we have carried out a measurement of joint resistance of Bi-2223/Ag tapes at 77 K. A pancake coil was wound by Bi-2223/Ag tape. Both ends the tape were overlapped and soldered to each other. The DC current is induced in the pancake coil by energizing the excitation coil wound by copper wire closely located to the pancake coil. The decay behaviour of the current in coils was clearly separated in two regimes, and initial fast decay of the order of minutes followed by a slow logarithmic-like decay, From this data, the resistance of the joint was evaluated as 2.74 n$\Omega$.

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