자기조직화 지도를 이용한 반도체 패키지 내부결함의 패턴분류 알고리즘 개발

The Development of Pattern Classification for Inner Defects in Semiconductor packages by Self-Organizing map

In this study, researchers developed the est algorithm for artificial defects in the semic packages and performed to it by pattern recogn technology. For this purpose, this algorithm was I that researcher made software with matlab. The so consists of some procedures including ultrasonic acquistion, equalization filtering, self-organizing backpropagation neural network. self-organizing ma backpropagation neural network are belong to metho neural networks. And the pattern recognition tech has applied to classify three kinds of detective pa semiconductor packages. that is, crack, delaminat normal. According to the results, it was found estimative algorithm was provided the recognition r 75.7%( for crack) and 83.4%( for delamination) 87.2 % ( for normal).