Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2002.05a
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- Pages.126-129
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- 2002
A Study on the Process Condition Optimization of Lead Free Solder Ball
무연 솔더 볼의 공정조건 최적화에 관한 연구
Abstract
This article presents that the affecting factors to solderability and initial reliability. It was discussed that effect of the solder ball hardness and composition on the reliability of solder joints. In this study, lead free solder alloys with compositions of Sn-Cu, Sn-Ag, Sn-Ag-Cu, Sn-Ag-Cu-Bi were applied to the
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