Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2002.05a
- /
- Pages.117-120
- /
- 2002
Optimal Shape of $\mu$ BGA Solder Joints and Thermal Fatigue Life
$\mu$ BGA 솔더접합부의 형상과 수명평가
Abstract
In this paper, several methods to predict the solder joint shape are studied. Although there are various methods to predict the solder joint shape, such as truncated sphere method, force-bal tranced analytical solution, and energy-based methods like surface evolver developed by Ken Brakke, we calculate solder joint shape of
Keywords