징케이트 공정 변화에 따른 무전해 니켈 도금 막의 접착력향상

Adhesion improvement of electroless plated Ni layer by modifying zincating process

  • 이성기 (한양대학교, 재료공학과) ;
  • 진정기 (한양대학교, 재료공학과) ;
  • 김영호 (한양대학교, 재료공학과)
  • 발행 : 2002.05.01

초록

The adhesion of electroless plated Ni layer on Al/Si substrates has been investigated. The zincating treatment was conducted with a conventional method and a modified method. In a modified method, ultrasonic agitation was applied during zincating. Adhesion strength was evaluated by a pull-off test. The ultrasonic agitation during zincating increased the nucleation density of Zn particles and refined Zn particle size. the adhesion strength of electroless Ni layer deposited on the modified zincated surface was higher than that on the conventionally zincated surface. the improvement of adhesion was attributed to the fine and dense Zn particles.

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