한국소성가공학회:학술대회논문집 (Proceedings of the Korean Society for Technology of Plasticity Conference)
- 한국소성가공학회 2002년도 금형가공 심포지엄
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- Pages.68-75
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- 2002
3차원 입체요소를 사용한 정밀 전자부품의 사출성형해석
Numerical Analysis for Injection Molding of Precision Electronics Parts using Three-Dimensional Solid Elements
- 발행 : 2002.02.01
초록
Most of numerical analyses for injection molding have been based on the Hele Shaw's approximation: two-dimensional flow analysis. In some cases, that approximation causes significant errors due to loss of geometrical information as well as simplification of the flow characteristics along the thickness direction. The present work covers numerical analyses of injection molding using three-dimensional solid elements. The accuracy of the analysis results has been verified through some numerical examples in comparison with the classical shell-based approach. The proposed approach are then applied to predict product defects and to improve flow characteristics for a precision electronics part. In addition, design of experiment has been utilized in order to find the optimal process conditions for better product quality.