Fabration of PLC susbstrate by slurry filling and sandblasting Method

Tape casting 법과 Sandblasting 법을 이용한 광소자용 기판 제조 (1)

  • 조윤희 (홍익대학교 신소재공학과) ;
  • 김용석 (홍익대학교 신소재공학과) ;
  • 이용호 (홍익대학교 신소재공학과)
  • Published : 2001.11.08

Abstract

In this study, nano-sized powders of $Si0_2-0^{\sim}15mol%B_2O_3$ composition were prepared by sol-gel processing method using TEOS(Tetra ethyl ortho silicate) and $H_3BO_3$ solution. The powders were tape-cast on High silicate glass sheet(HSG) substrate and sintered to form a layer of undercladding for the planar light wave module, During the sol-gel processing, $H_2O/Si$ mole ratio were varied to modify the size of the powders in a range from 600 to 75nm. The dispersion of the powder was modified by changing the pH of the slurry. Sintering temperature of the tape was observed to decrease with the size of the powder and the $B_2O_3$ content in the powder. When the silica powders of 75-125nm in diameter containing 15mol% $B_2O_3$ were used, 98 TD% was obtained at $1250^{\circ}C$, which is approximately $300^{\circ}C$ reduction in sintering temperature compared with micrometer-sized powders.

Keywords