Improvement of ITO etching uniformity in a large area plasma source

대면적 플라즈마 소스에서의 ITO 식각균일도 향상

  • 김진우 (인하대학교 정보통신공학부) ;
  • 조수범 (인하대학교 정보통신공학부) ;
  • 김봉주 (인하대학교 정보통신공학부) ;
  • 박세근 (인하대학교 정보통신공학부) ;
  • 오범환 (인하대학교 정보통신공학부) ;
  • 이종근 (인하대학교 정보통신공학부)
  • Published : 2001.11.08

Abstract

A large area plasma source using parallel $2{\times}2$ ICP antennas showed improved etching uniformity by the E-ICP operation. ITO etching process with $CH_4$ gas chemistry is optimized with the DOE (Design of Experiment) based on Taguchi method. Various methane ratios in methane and argon mixture are compared to confirm the effect of polymerization. The analysis shows that the effect of bias power is the largeset. We obtained higher ITO etching rate and better uniformity on $350{\times}300mm$ substrate at the 50Hz magnetization frequency of the E-ICP operation technique,

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