대류와 전도 열전달을 이용한 전자부품의 냉각특성 수치해석

Numerical Analysis on Cooling Characteristics of Electronic Components Using Convection and Conduction Heat Transfer

Cooling characteristics using convection and conduction heat transfer in a parallel channel with extruding heat sources are studied numerically. A two-dimensional model has been developed for numerical prediction of transient, compressible, viscous, laminar flow, and conjugate heat transfer between parallel plates with uniform block heat sources. The finite volume method is used to solve this problem. The considered assembly consists of two channels formed by two covers and one PCB which has three uniform heat source blocks. Five different cooling methods are considered to find efficient cooling method in a given geometry and heat source. The velocity and temperature fields, local temperature distribution along surface of blocks, and the maximum temperature in each block are obtained.