한국신뢰성학회:학술대회논문집 (Proceedings of the Korean Reliability Society Conference)
- 한국신뢰성학회 2001년도 정기학술대회
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- Pages.239-244
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- 2001
초음파를 이용한 반도체의 신뢰성 평가
Reliability Evaluation of Semiconductor using Ultrasonic
- Jang, Hyo-Sung (Graduate School of Hanyang University) ;
- Ha, Yop (Graduate School of Hanyang University) ;
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Jang, Kyung-Young
(School of Mech. Eng., Hanyang University) ;
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Kim, Jung-Kyu
(School of Mech. Eng., Hanyang University)
- 발행 : 2001.06.01
초록
Today, Ultrasonic is used as an important non-destructive test tool of semiconductor reliability evaluation and failure analysis. The semiconductor packaging trend goes to develop thin package, this trend makes difficult to inspect to defect in semiconductor package. One of the important problem in all semiconductor is moisture absorption in the atmosphere. This moisture causes crack or delamination to package when the semiconductor package is soldered on PCB. Reliability evaluation of semiconductor's object is investigating the effect of this moisture. For that reason, this study is investigating the effect of this moisture and reliability evaluation of semiconductor after preconditioning test and scanning acoustic microscope.
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