Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2001.07a
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- Pages.165-169
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- 2001
A Study on Wettability and Interfacial reaction of Sn-Ag-Cu solder
Sn-Ag-Cu solder의 wetting 특성과 계면반응
Abstract
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