초음파 Spectroscopy에 의한 Resin내의 크기 측정에 관한 연구

In manufacturing process of semiconductor package, thermal stress owing to high temperature in moulding and bubbles generated in chip bonding process become main causes to producing void. Therefore, on this study we evaluated quantitatively void size by ultrasonic spectroscopy method which analyze the frequency of this received pulse using pulses with broad band frequency, and after destructive test we verified effectiveness of sizing void by ultrasonic spectroscopy as we find error degree between the real size of void and the sizing void by ultrasonic spectroscopy.