Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 2001.07c
- /
- Pages.1890-1892
- /
- 2001
Fabrication of 3-dementional microstructures for bulk micromachining by SDB and electrochemical etch-stop
SDB와 전기화학적 식각정지에 의한 블크 마이크로머신용 3차원 미세구조물 제작
- Chung, Yun-Sik (Electronic Eng. Pukyung national univ.) ;
-
Chung, Gwiy-Sang
(school of information and system Eng. Dongseo univ.)
- Published : 2001.07.18
Abstract
This paper described on the fabrication of microstructures by DRIE(Deep Reactive Ion Etching). SOI(Si-on-insulator) electric devices with buried cavities are fabricated by SDB technology and electrochemical etch-stop. The cavity was fabricated the upper handling wafer by Si anisotropic etch technique. SDB process was performed to seal the fabricated cavity under vacuum condition at -750 mm Hg. In the SDB process, captured air and moisture inside of the cavities were removed by making channels towards outside. After annealing(1000
Keywords