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Organic Additives effect affected on the Property of Electrodeposited copper foil

  • 발행 : 2001.07.18

초록

In this paper, the amount of additives in the electrode were investigated the relation of the mechanical properties and surface luminance of copper foil. Especially, organic compound of PEG(Poly-ethylene Glycol) was added from 1 to 20ppm for the propose of increasing the mechanical property and the surface state. The surface luminance of copper foil is appealed 69.25 at 2ppm-15A/$dm^2$ and 68.25 at 2ppm-10A/$dm^2$. It guess that 10ppm-10A/$dm^2$ occurred pin-hole. Tensile strength was not showed the significant difference but elongation appealed the most value at 5ppm-15A. We earned that the most PEG value of mechanical properties is 5 PPM.

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