한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2000년도 춘계학술대회 논문집 전자세라믹스 센서 및 박막재료 반도체재료 일렉트렛트 및 응용기술
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- Pages.47-51
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- 2000
Characterization of SOI Wafers Fabricated by a Modified Direct Bonding Technology
- Kim, E.D. (Power Semicon. Res. Group, Korea Electrotechnology Research Institute) ;
- Kim, S.C. (Power Semicon. Res. Group, Korea Electrotechnology Research Institute) ;
- Park, J.M. (Power Semicon. Res. Group, Korea Electrotechnology Research Institute) ;
- Kim, N.K. (Power Semicon. Res. Group, Korea Electrotechnology Research Institute) ;
- Kostina, L.S. (A. F. Ioffe Physico-Technical Institute, Russian Academy of Science)
- 발행 : 2000.04.28
초록
A modified direct bonding technique employing a wet chemical deposition of