Proceedings of the KSME Conference (대한기계학회:학술대회논문집)

The Korean Society of Mechanical Engineers (대한기계학회)
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The Experimental Study of Miniature Heat Pipes for Cooling Microprocessor Chips

전자칩 냉각을 위한 소형 히트 파이프에 대한 실험적 연구

  • 이상민 (부산대학교 기계공학과 대학원) ;
  • 김흥배 (부산대학교 기계공학과 대학원) ;
  • 양장식 (부산대학교 기계공학부) ;
  • 이기백 (부산대학교 기계공학부)
  • Published : 2000.04.20
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Abstract

This paper presents the experimental investigation about miniature heat pipe for notebook PC. The focus of analysis is the operating temperature not to exceed $65^{\circ}C$ maximum allowable CPU surface temperature. Copper is used to heat pipe material and brass is wick material, and working fluid is selected to water. This cooling system is heat spreader method using a aluminum plate, since this method is most commonly used. According to the present study, heat for 3mm heat pipe, 8W, and for 4mm heat pipe, 10W, is found to power dissipation limit respectively, Soon after this investigation, sufficient long term life test should be followed.

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