제어로봇시스템학회:학술대회논문집
- 2000.10a
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- Pages.358-358
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- 2000
Control of Wafer Temperature Uniformity in Rapid Thermal Processing using an Optimal Iterative teaming Control Technique
최적 반복 학습 제어기법을 이용한 RTP의 웨이퍼 온도균일제어
Abstract
An iterative learning control technique based on a linear quadratic optimal criterion is proposed for temperature uniformity control of a silicon wafer in rapid thermal processing.