제어로봇시스템학회:학술대회논문집
- 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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- Pages.222-222
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- 2000
반도체 웨이퍼용 스크라이빙 머신의 개발
Development of Scribing Machine for Semiconductor Wafer
초록
The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing such as blade, wafer, cutting water and cutting conditions. Moreover we can not applicable this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer as GaAs. In older to overcome this problem, a new dicing process is necessary. This paper describes a new machine using scriber and precision servo mechanism in order to dice a semiconductor wafer.