대한전자공학회:학술대회논문집 (Proceedings of the IEEK Conference)
- 대한전자공학회 2000년도 추계종합학술대회 논문집(2)
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- Pages.108-111
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- 2000
RF대역에서의 반도체 package 특성 측정에 관한 연구
A Study on Measurement of Semiconductor Package in RF Regime
초록
The electrical characteristics of MQFP packages have been measured in RF regime. The s-parameter of the lead frame has been measured using the test fixture on which the do-capped package was mounted. A simple lumped equivalent circuit modeling of the lead frame and the test fixture can provide reasonable model parameters up to the frequency of 200 MHz.
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