한국복합재료학회:학술대회논문집 (Proceedings of the Korean Society For Composite Materials Conference)
- 한국복합재료학회 2000년도 추계학술발표대회 논문집
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- Pages.183-186
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- 2000
전자 패키징용 직조형 금속복합재료 개발
Development of Textile Metal Matrix Composites for Electronic Packaging
초록
A new textile metal matrix composite fur electronic packaging was developed and characterized. The thermal management materials consist of a plain woven carbon fabric as reinforcement and pure aluminum as matrix. The finite element method has been utilized in the analysis of thermal stress between the constituent components of packaging. The prototype part was manufactured by the liquid pressurizing method. The composite has CTE values of 4 to
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