전자 패키징용 직조형 금속복합재료 개발

Development of Textile Metal Matrix Composites for Electronic Packaging

A new textile metal matrix composite fur electronic packaging was developed and characterized. The thermal management materials consist of a plain woven carbon fabric as reinforcement and pure aluminum as matrix. The finite element method has been utilized in the analysis of thermal stress between the constituent components of packaging. The prototype part was manufactured by the liquid pressurizing method. The composite has CTE values of 4 to $5{\times}10^{-6}\;^{\circ}C^{-1}$10 in the range of $25^{\circ}C$ ~ 175$^{\circ}C$, resulting in good agreement with electronic materials such as Si and GaAs.