Proceedings of the Korean Society For Composite Materials Conference (한국복합재료학회:학술대회논문집)
- 2000.11a
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- Pages.58-62
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- 2000
Fabrication Process and Analysis of Thermal Properties of High Volume Fraction SiCpi/Al Metal Matrix Composites for Heatsink Materials
반도체 heatsink용 고부피분율 SiCp/Al 금속복합재료의 제조공정 및 열적특성분석
Abstract
The fabrication process and analysis of thermal properties of 50~76vo1% SiCp/Al metal matrix composites(MMCs) for heatsink materials in electronic packaging were investigated. The 50~76vo1% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 85~170W/mK and coefficient of thermal expansion(CTE) were ranged 10~6ppm1k. Specially, the thermal conductivity and CTE of 71vo1%SiCp/Al MMCs were ranged 115~156W/mK and 6~7ppm/K. respectively, which showed a improved thermal properties than the conventional electronic packaging materials such as ceramics and metals.