Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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New Fabrication Method of Solder Ball for Micro BGA package

  • Ko, H-S. (Materials Science & Engineering Divisions) ;
  • Chang, J-Y (Materials Science & Engineering Divisions) ;
  • Yoo, M-K (Materials Science & Engineering Divisions) ;
  • Moon, I-G (Materials Science & Engineering Divisions)
  • Published : 2000.04.01
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