Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2000.11a
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- Pages.129-133
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- 2000
Fabrication and Properties of Low Temperature Firing Substrate using Sol-gel process
Sol-gel법을 이용한 저온소결기판의 제조 및 특성
Abstract
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