Proceedings of the Korean Vacuum Society Conference (한국진공학회:학술대회논문집)
- 2000.02a
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- Pages.60-60
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- 2000
The improvement of Cu metal film adhesion on polymer substrate by the low-power High-frequency ion thruster
- Jung Cho (Department of Ceramic Engineering, Yonsei University) ;
- Elena Kralkina (Thin Film Technology Research Center, Korea Institute of Science and Technology) ;
- Yoon, Ki-Hyun (Department of Ceramic Engineering, Yonsei University) ;
- Koh, Seok-Keun (Thin Film Technology Research Center, Korea Institute of Science and Technology)
- Published : 2000.02.01
Abstract
The adhesion interface formation between copper and poly(ethylene terephthalate)(PET), poly(methyl methacrylate)(PMMA) and Polyimide films was treated using Ion assisted reaction system to sequential sputter deposition by High-Frequency ion source. The ion beam modification system used a new type of low power HF ion thruster for space application as new low thruster electric propulsion system. Low power HF ion thruster with diameter 100mm gives the opportunity to obtain beams of Ar+ with currents 20~150 mA (current density 0.5~3.5 mA/cm2) and energy 200~2500eV at HF power level 10~150 W. Using Ar as a working gas it is possible to obtain thrust within 3~8 mN. Contact angles for untreated films were over 95
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