Proceedings of the Korean Society of Marine Engineers Conference (한국마린엔지니어링학회:학술대회논문집)
- 2000.05a
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- Pages.105-109
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- 2000
Thermal Behaviors Analysis for SOI Wafers
SOI 웨이퍼의 열적거동 해석
Abstract
Micronization of sensor is a trend of the silicon sensor development with regard to a piezoresistive silicon pressure sensor the size of the pressure sensor diaphragm have become smaller year by year and a microaccelerometer with a size less than 200-300