Proceedings of the Korean Society of Marine Engineers Conference (한국마린엔지니어링학회:학술대회논문집)
- 2000.05a
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- Pages.100-104
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- 2000
Finite Element Analysis for Thermal Stresses of Microaccelerometers
마이크로가속도계의 열응력에 대한 유한요소해석
Abstract
This paper deals with finite element analyses of residual stresses causing popping up which are induced in micromachining processes of a mcroaccelerometers. After heating the tunnel gap up to 100 degree and get it through the cooling process and the additional bean up to 80 degree and get is through the cooling process. We learn the thermal internal stress of each shape and compare the results with each other after heating the tunnel gap up to 400 degree during the Pt deposition process. We want to seek after the real cause of this pop up phenomenon and diminish this by change manufacturing processes of microaccelerometer by electrostatic force.