Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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Angle Measurement of MEMS Devices Image Processing

Image Processing에 의한 MEMS소자의 미세한 각도측정

  • Ko, Jin-Hwan (Electrical and Electronic Engineering College of Engineering, Chung-Ang University) ;
  • Kim, Ho-Seong (Electrical and Electronic Engineering College of Engineering, Chung-Ang University)
  • 고진환 (중앙대학교 전자전기공학부) ;
  • 김호성 (중앙대학교 전자전기공학부)
  • Published : 2000.07.17
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Abstract

This paper reports on the measurement of angle between micro mirror and substrate in. the Micro Optical Cross Connect(MOXC). MOXC consists of beam collimators and $N{\times}N$ micro mirrors that are fabricated by using MEMS technology. Using subpixel level image processing, it is possible to measure the angle with the resolution of 0.27$^{\circ}$.

Keywords