Fabrication Process and Characterization of High Thermal Conductivity-Low CTE SiCp/Al Metal Matrix Composites by Pressure Infiltration Casting Process

가압함침법에 의한 고열전도도-저열팽창계수 SiCp/Al 금속복합재료의 제조공정 및 특성평가

The fabrication process and thermal properties of 50~71vol% SiCp/Al metal matrix composites (MMCs) were investigated. The 50~71vol% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 118~170W/mK and coefficient of thermal expansion (CTE) were 9.5~$6.5{\times}10^{-6}/K$. Specially, the thermal conductivity and CTE of 71vol%SiCp/Al MMCs were 115~156W/mK and 6~$7{\times}10^{-6}/K$. respectively, which showed a improved themal properties than the conventional electronic packaging materials such as ceramics and metals.