Proceedings of the Korean Institute of Surface Engineering Conference (한국표면공학회:학술대회논문집)
- 1999.10a
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- Pages.45-46
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- 1999
The Dielectric Properties of BPDA-PDA Polyimide with Various Metallization materials (Al, Cu, and Cr/Cu)
다양한 금속배선재료(Al, Cu, Cr/Cu)에 따른 BPDA-PDA 폴리이미드의 유전특성
Abstract
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