A 3D BGA Inspection Algorithm with Subpixel Accuracy

부화소 정밀도를 가지는 3차원 BGA 검사 알고리즘

Inspection of BGAs presents several challenges for modem measurement equipment. No only must these systems be fast and accurate, they must deal with the special challenges presented by very small shiny metal spheres. For accurate measurement, we propose an algorithm which fits for estimating the accurate ball height using 2-D curve-fitting algorithm. The real boundary between two adjacent pixels and the real ball diameter are measured with subpixel accuracy Experimental results show that the proposed method calculates the ball height and diameter with subpixel accuracy and is robust in local noise with low measurement error.