한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 1999년도 추계 기술심포지움 논문집
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- Pages.13-21
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- 1999
Development of a new wafer level package by using a redistribution technique
- Lee, Young-Min (Compound Semiconductor Department Micro-Electronics Technology Lab. Electronics and Telecommunications Research Institute) ;
- Lee, Sang-Pok (Compound Semiconductor Department Micro-Electronics Technology Lab. Electronics and Telecommunications Research Institute) ;
- Ju, Chul-Won (Compound Semiconductor Department Micro-Electronics Technology Lab. Electronics and Telecommunications Research Institute) ;
- Park, Seong-Su (Compound Semiconductor Department Micro-Electronics Technology Lab. Electronics and Telecommunications Research Institute)
- 발행 : 1999.11.01