Cure Characteristics of Metal Particle Filled DGEBA/MDA/SN/ zeolite Composite System for EMI Shielding

The cure characteristics of metal particle filled DGEBA/MDA/SN/ zeolite epoxy resin composite system for EMI shielding were investigated by dynamic DSC run method and FT-lR spectroscopy. As the heating rate increased, the peak temperature on dynamic DSC curve increased because of the rapid cure reaction. From the straight line of the Kissinger plot, the curing reaction activation energy and pre-exponential factor could be obtained. As the post-curing time at 15$0^{\circ}C$ increased, the glass increased the glass transition temperature or the thermal stability increased. When the post curing time is too long, the system filled with metallic Al particle can be thermally oxidized by the catalytic reaction of metal filler and the thermal stability of the composite for the EMI shielding application may be decreased.