동테이프 위의 Bi-계 초전도 후막에서 전구체분말 조성의 영향

The Effect of the precursor powder composition for Bi-system superconducting thick films on Cu tapes

  • 한상철 (한전전력연구원 전력계통연구실) ;
  • 성태현 (한전전력연구원 전력계통연구실) ;
  • 한영희 (한전전력연구원 전력계통연구실) ;
  • 이준성 (한전전력연구원 전력계통연구실) ;
  • 김상준 (한전전력연구원 전력계통연구실)
  • Published : 1999.05.01

Abstract

A well oriented Bi2212 superconductor thick films were fabricated by screen printing with a Cu-free Bi-Sr-Ca-O mixture powder on a copper plate and heat-treating at 820-88$0^{\circ}C$ for several minute in air. During the heat-treatment, the printing layer partially melted by reaction between the Cu-free precursor and CuO of the oxidizing copper plate. In the partial melting state, it is believed that the solid phase is Bi-free phase and Cu-rich phase and the composition of the liquid is around Bi : Sr : Ca : Cu = 2 : 2 : 0 : 1. Following the partial melting, the Bi2212 superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows. With decreasing the Bi composition in the precursor powder, the critical temperature(T$_{c}$) of the fabricated Bi2212 thick film increased to about 79 K.K.

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