구리 배선공정에서의 CVD TaN 확산방지막에 관한 연구

A study on CVD TaN as a diffusion barrier for Cu interconnects

  • Im, Se-Joon (School of Materials Science and Engineering, Seoul National University) ;
  • Kim, Soo-Hyun (School of Materials Science and Engineering, Seoul National University) ;
  • Park, Ki-Chul (Samsung Electronics Co. Ltd.) ;
  • Cho, Sung-Rae (School of Materials Science and Engineering, Seoul National University) ;
  • Kim, Ki-Bum (School of Materials Science and Engineering, Seoul National University)
  • 발행 : 1999.11.01