A Study on the Characteristics of the Inductively Coupled SF6 Plasma

유도 결합형 SF6플라즈마 특성에 관한연구

  • Published : 1999.11.01

Abstract

This paper represents the characteristic analyses for the etching in SF6 plasma and the plasma itself, based on the specific knowledges on the discharge mechanism of SF6 plasma which is widely used for the applications of dry etching, using Radio Frequency Inductively Coupled Plasma (RFICP) by measuring electron density, electron temperature then observing their relationship to find the effect of discharge mechanism of SF6 plasma to the etching in contrast to the existing method of finding optimal discharge condition by heuristic.

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