Proceedings of the Korean Society For Composite Materials Conference (한국복합재료학회:학술대회논문집)
- 1999.04a
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- Pages.109-113
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- 1999
Fabrication Process of High Thermal Conductivity and Low CTE SiCp/Al Metal Matrix Composites for Electronic Packaging Applications
전자패키지용 고열전도도-저열팽창계수 SiCp/Al 금속복합재료의 제조공정
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