Thermal Cycling Reliability of Bilayer Passivation Films in Plastic-Encapsulated Memory Devices
프라스틱으로 조립되는 반도체 제품에서 2층 구조 패시베이션 막질이 갖는 T/C 신뢰성
- Lee Seong-Min (Department of Materials Science and Engineering, University of Inchon)
- Published : 1999.04.01
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