Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 1998.11c
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- Pages.1004-1006
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- 1998
Packaging of Vacuum Microelectronic Device using Electrostatic Bonding
정전 열 접합에 의한 진공전자소자의 패키징
- Ju, Byung-Kwon (KIST, Electronic Materials and Devices Research Center) ;
- Lee, Duck-Jung (KIST, Electronic Materials and Devices Research Center) ;
- Oh, Myung-Hwan (KIST, Electronic Materials and Devices Research Center)
- Published : 1998.11.28
Abstract
Mo-tip FED of 1 inch diagonal was vacuum sealed using sodalime-to-sodalime glass electrostatic bonding under
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