NOVEL 3-DEMINSIONAL MEMORY STACK PACKAGES USING POLYMER INSULATED SIDEWALL

  • Ko, H.S. (Department of Materials Science & Engineering, KAIST) ;
  • Kim, J.S. (Department of Materials Science & Engineering, KAIST) ;
  • Yoon, H.G. (Department of Materials Science & Engineering, KAIST) ;
  • Jang, S.Y. (Department of Materials Science & Engineering, KAIST) ;
  • Cho, S.D. (Department of Materials Science & Engineering, KAIST) ;
  • Paik, K.W. (Department of Materials Science & Engineering, KAIST)
  • 발행 : 1998.08.01