한국재료학회:학술대회논문집 (Proceedings of the Materials Research Society of Korea Conference)
- 한국재료학회 1998년도 IUMRS-ICEM ABSTRACT BOOK
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- Pages.139.4-139
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- 1998
EFFECTS OF TEMPERATURE AND pH OF PLATING SOLUTION ON Ni/Au BUMP FORMATION FOR FLIP CHIP INTERCONNECTION
- Jeon, Seong-Ho (Division of Materials Science and Eng., Hanyang Univ.) ;
- Park, Jong-Wan (Division of Materials Science and Eng., Hanyang Univ.)
- 발행 : 1998.08.01